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Title: Orthodyne Electronics (USA)
Description: Design and manufacture wire bonding equipment for the semiconductor, automotive, and industrial markets worldwide. The wire bonders ultrasonically weld aluminum wires ranging from 1.2-25 mil/33-625 microns in diameter.
Directory: Science/Technology/Acoustics,_Ultrasound_and_Vibration/Ultrasound/Companies/Power_Ultrasound
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