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Title: A.P.E. Corp
Description: Manufacturer of surface mount (SMT) repair equipment, including ball grid array (BGA), quad flat pack (QFP) and flip chip removal, circuit board rework stations, and temperature controlled reheaters. Site includes product photos and descriptions, plus general instructions for replacement of high density packages on circuit boards.
Directory: Business/Electronics_and_Electrical/Production_Equipment_and_Materials/Tools_and_Equipment/Printed_Circuit_Boards
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