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Title: Taiflex Scientific Co. Ltd.
Description: Manufacturer of flexible copper cladded laminate and coverlay including coating, adhesiveless-FCCL, chip on film(COF), photo-imaginable-coverlay (PIC), chip on glass(COG) and tape automatic bonding (TAB) for flexible printed circuit(FPC). Includes product descriptions and photographs of flexible circuit applications.
Directory: Business/Electronics_and_Electrical/Production_Equipment_and_Materials/Materials_and_Supplies
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